Processes
Alta Microtec™ offers a wide range of wafer fab processes and metrology capabilities. Processes include:
Lithography
Proximity and contact litho with backside alignment capability
Stepper and scanner
Laser direct write
Positive and negative photoresists from 0.2um to 100um thick
Lift-off
Etch & Clean
Dry etching including RIE, DRIE, and ion mill
Wet etch
Wet and dry strip and clean
Polyimide & PBO
Photo active
Etchable
Blanket coat
..
Deposition & Film Growth
Oxidation
PVD
LPCVD
PECVD
ALD
CNT
Anneal & Bake
Tube anneal
RTA
Bakes and cures
Alta Microtec processes various substrate sizes, including:
75mm, 100mm, 125mm, 150mm, 200mm, and 300mm wafers
1 x 1 inch to 9 x 9 inch squares
Unusual form factors including 9mm thick wafers, wafer pieces, and individual chips or die have been accommodated
Examples of the substrates utilized include:
Silicon (Si), Silicon Carbide (SiC), GaAs
Sapphire
Alumina (Al2O3) and Ceramics
Quartz, Fused Silica, Glass
Lithium Niobate, Lithium Tantalate
Metal